Hanmi Semiconductor to Establish U.S. Subsidiary in San Jose by 2026, Targeting AI Chip Market

Hanmi Semiconductor Plans U.S. Subsidiary to Strengthen AI chip market Presence

South Korea’s Hanmi Semiconductor announced on May 15 that it will establish a U.S. subsidiary, Hanmi USA, in San Jose by the end of 2026. The move AIms to expand its footprint in the American chip market and provide localized technical support amid rising demand for AI semiconductors.

The semiconductor equipment manufACTurer noted that orders for its thermo-compression bonders—used in high-bandwidth mEMOry (HBM)—are heavily concentrated in the second quarter. The company expects continued momentum in the second half of the year, driven by the start of mass production of HBM4 memory.

Hanmi USA will enable the company to work more directly with U.S.-based foundries, chip packAGIng firms, and hyperscalers such as Microsoft and Google, all of which are developing AI chips. Additionally, Hanmi plans to sell its 2.5D packaging tools and BOC COB bonder to foundries, chip packagers, and memory manufacturers starting this year.